STUDY OF PROPERTIES OF LEAD-FREE SOLDER TYPE Au-20Sn AT ULTRASOUND ASSISTANCE
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چکیده
The main aim of this work was to determine the soldering, thermal and mechanical properties of joints fabricated by use of Au-20Sn solder. Soldered joints were fabricated by application of a flux-free process with assistance of power ultrasound. By acting of power ultrasound, the Au-20Sn solder wets the surface of Cu, Ag and Ni substrates. The contact wetting angle on all substrates varied within 1°≤α≤10° interval. The melting point of solder was determined using of DSC analysis and soldering temperature was then selected. The shear strength of soldered joints was determined. The highest shear strength (195 MPa) was observed on Cu substrate and the lowest (20 MPa) was observed on Ni substrate. It is supposed that this solder may be a suitable substitution for Pb-5Sn solder for higher application temperatures.
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